MediaTek has introduced its latest midrange chipset, the Dimensity 6300, as a successor to last year’s Dimensity 6100+. It features an overclocked main Cortex-A76 CPU cluster, now running at 2.4 GHz compared to the previous 2.2 GHz. The CPU configuration includes 2x Cortex-A76 cores joined by 6x Cortex-A55 cores clocked at 2 GHz.
Manufactured on TSMC’s 6nm process, the Dimensity 6300 includes a Mali-G57 MC2 GPU. MediaTek claims the new chip should provide a 10% boost in CPU performance compared to the outgoing 6100+.
The Dimensity 6300 also includes MediaTek UltraSave 3.0+ technology for power saving and an integrated 5G modem compliant with the 3GPP Release 16 standard.
The chipset supports the same LPDDR4x RAM and UFS 2.2 storage as its predecessor and can power displays with resolutions of up to 1080 x 2520px. It also supports up to 108MP main cameras, dual-band Wi-Fi 5 (a/b/g/n/ac), and Bluetooth 5.2 connectivity.
The Realme C65 5G is expected to be the first phone to launch with the Dimensity 6300 later this month.
